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09:00~09:05 | ¿¬±¸È¸ ȸÀå Àλ縻 | ±è°ïÈ£ ±³¼ö (¿¬±¸È¸ ȸÀå) | ||
09:05~09:35 | PI-APC ±â¹ÝÀÇ ¿øÀڵβ² ÆÐÅÏ´× Á¦¾î±â¼ú ¼Ò°³ | ±è°ïÈ£ ±³¼ö (¼¿ï´ë) | ||
09:35~10:05 | ¹Ýµð °øÁ¤Çâ Ç¥ÁØÈµÈ °í°¨µµ ±¤Áø´Ü ¼¾¼ ±â¼ú | ÀÌÁø¿µ ¹Ú»ç (±â°è¿¬) | ||
10:05~10:20 | Break | - | ||
10:20~10:50 | ¼³ºñ Áø´ÜÀÇ ¾î·Á¿ò°ú ¼¾¼ µ¥ÀÌÅÍ È°¿ë ¹æ¾È | ¹®Á¤ÀÏ ¹Ú»ç (»ï¼ºÀüÀÚ ) | ||
10:50~11:20 | ¹ÝµµÃ¼ °øÁ¤ Á¦¾î ±â¼ú ¼Ò°³ | ÀÌÁ¾¹Î ±³¼ö (¼¿ï´ë) | ||
11:20~11:50 | AIÀÚÀ²¿î¿µÇü ½Ç½Ã°£ ÇнÀ±â¹Ý ´Ù º¯·® ¹Ì¼¼°øÁ¤ ÃßÀû, ¿¹Ãø ¹× Á¦¾î | ÇÑ´ë¼ö ´ëÇ¥ (À̵ðÄÚ¾î) | ||
11:50~13:00 | Á¡ ½É | ¶ô±¸Á¤ ÇÑÁ¤½Ä | ||
13:00~13:50 | Lab Tour | ÇöóÁÀÀ¿ë¿¬±¸½Ç- °øÁ¤Áø´Ü±â¼ú ¼Ò°³ | ||
13:50~14:30 | Make Your Equipment Smart ¹Ýµð °øÁ¤ Àåºñ¸¦ ½º¸¶Æ® ÇÏ°Ô- ½ÃÁð 2 | À±Á¤½Ä ´ÜÀå (Çѱ¹ÇÙÀ¶ÇÕ¿¡³ÊÁö¿¬±¸¿ø) | ||
14:30~15:10 | ÈÇÐÀû ±â°èÀû ÆòźÈ(CMP) °øÁ¤ÀÇ °¡»ó°èÃøÀ» À§ÇÑ ÁØÁöµµ ȸ±Í ¸ðµ¨ | ±èâ¿í ±³¼ö (¿¬¼¼´ë) | ||
15:10~15:30 | Break | - | ||
15:30~16:10 | ¹ÝµµÃ¼ ¼ÒºÎÀå °üÁ¡ÀÇ ¹ÝµµÃ¼°øÁ¤Áø´ÜÁ¦¾î | È«»óÁø ±³¼ö(¸íÁö´ë) | ||
16:10~16:50 | Plasma Enhanced Process Technology and Advanced Package for the Semiconductor Device | ¿øÁ¦Çü ´ëÇ¥ÀÌ»ç (µµÄìÀÏ·ºÆ®·ÐÄÚ¸®¾Æ) | ||
16:50~17:30 | PI-VM: TTTM¿¡¼ ºÎÅÍ Etching Profile Á¦¾î±îÁö Fab Data¸¦ AI¿¡°Ô ÇнÀ½ÃÅ°´Â ¹ý | ¹Ú¼³Çý ¹Ú»ç (»ï¼ºµð½ºÇ÷¹ÀÌ) | ||
17:30~18:00 | ³íÀÇ(°øÁ¤Áø´ÜÁ¦¾î±â¼ú °íµµÈ¸¦ À§ÇÑ »ê¡¤ÇС¤¿¬ÀÇ Çù·Â ¹æ¾È¿¡ ´ëÇÑ ÀÇ°ß ¼öÁý) ¹× ¸¶¹«¸® | ±è°ïÈ£ ±³¼ö (¿¬±¸È¸ ȸÀå) |
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