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09:00-09:05 | °³È¸»ç | Á¶Á÷À§¿øÀå | |
09:05-09:10 | Àλ縻 | ÇÐȸÀå | |
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10:00-10:40 | Technology Trend of Semiconductor Memory |
±è¼ö±æ ÆÀÀå (SKÇÏÀ̴нº) |
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10:50~11:30 | NAND Flash Memory ±â¼ú µ¿Çâ ¹× ÇØ°á °úÁ¦ |
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11:30~12:40 | Á¡½É ½Ä»ç(70ºÐ) | - | µµ½Ã¶ô |
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12:40~13:20 | EUVL Ãֽбâ¼ú µ¿Çâ°ú ÇØ°á °úÁ¦ | ¾ÈÁøÈ£ ±³¼ö (ÇѾç´ë) |
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13:30~14:10 | Áø°ø¹ëºê Ãֽбâ¼ú µ¿Çâ°ú ÇØ°á °úÁ¦ | ±è¹èÁø ÀÌ»ç (ÇÁ¸®½Ã½º) |
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14:20~15:00 | Purification of Chemicals for Semiconductor Use by Ultra-clean lon Exchange Resins |
Noriko Hisano (ORGANO (ÀÏ)) |
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15:00~15:20 | Coffee Break (20ºÐ) | ||
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15:20~16:00 | SELECTIVE DEPOSITION: PEALD PROCESS |
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16:10~16:50 | Diagnostic Sensor Technology Development for Next Generation Plasma Etch |
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17:00~17:40 | Advanced Packaging Roadmap (IEEE EPS) And Technical Trends |
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17:40~18:00 | ¸¶¹«¸® | Á¶Á÷À§¿øÀå |
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